Lead Free Solder Paste
Lead Free Solder Paste
Product Description
NP 111 is halogen-free solder paste that meets the standards of modern lead-free soldering for both high-mix and high-volume circuit assemblies.
- 1. NP 111 lead-free solder paste has been formulated to give excellent printing and soldering performance.
- 2. It is designed for stencil printing in a surface mount process where post reflow cleaning is not required.
Np 111 Solder Paste
| FLUX TYPE | No-Clean |
| ALLOY MESH SIZE | Type 3, Type 4 |
| METAL CONTENT | 88.5+0.2(%) |
| SDS | |
| SOLDER ALLOY | Sn99Ag0.3Cu0.7 |
| SOLDER PASTE PRODUCT NUMBERS | NP 111 SOLDER PASTE |
| SPEC. SHEET | On Request |
Np 112 Solder Paste
| SPEC. SHEET | On Request |
| ALLOY MESH SIZE | Type 4 |
| FLUX TYPE | No-Clean |
| METAL CONTENT | 88.5+0.2(%) |
| SDS | |
| SOLDER ALLOY | Sn96.5Ag3.0Cu0.5 |
| SOLDER PASTE PRODUCT NUMBERS | NP 112 SOLDER PASTE |
